A5061800156- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Bayesian Modeling and Causal Inference
- Thermal properties of materials
- Silicon Carbide Semiconductor Technologies
- Heat Transfer Mechanisms
- Topic Modeling
- Data Management and Algorithms
- Advanced MEMS and NEMS Technologies
- Data Mining Algorithms and Applications
- Thermal Radiation and Cooling Technologies
- Constraint Satisfaction and Optimization
- Advanced Computational Techniques and Applications
- Advanced Text Analysis Techniques
- Advanced Sensor and Control Systems
- Advanced Sensor and Energy Harvesting Materials
- Natural Language Processing Techniques
- Power System Reliability and Maintenance
- Advanced Sensor Technologies Research
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Optimal Power Flow Distribution
- Service-Oriented Architecture and Web Services
- X-ray Diffraction in Crystallography
- GaN-based semiconductor devices and materials
Institute of Microelectronics
2018-2025
Chinese Academy of Sciences
2018-2025
Electric Power University
2024
Northeast Electric Power University
2024
Changchun University
2024
University of Chinese Academy of Sciences
2019-2023
Changchun University of Technology
2022-2023
Xi'an Jiaotong University
2022-2023
Zhongnan University of Economics and Law
2023
China Pharmaceutical University
2023
In three-dimensional (3D) stacking, the thermal stress of through-silicon via (TSV) has a significant influence on chip performance and reliability, this problem is exacerbated in high-density TSV arrays. study, novel hollow tungsten (W–TSV) presented developed. The structure provides space for release stress. Simulation results showed that W-TSV can 60.3% within top 2 μm from surface, be decreased to less than 20 MPa radial area 3 μm. ultra-high-density (1600 TSV∙mm−2) array with size 640 ×...
In recent decades, gallium nitride (GaN) high-electron-mobility transistor (HEMT) has become increasingly popular for microwave applications due to its wide bandgap and high saturated electron velocity. However, self-heating inhibits the improvement of electrical characteristics reduces device reliability. this study, a thermoelectric analysis based on embedded microfluidic cooling is performed. By embedding microchannel into silicon carbide (SiC) substrate, coolant can be introduced...
When chips perform numerous computational tasks or process complex instructions, they generate substantial heat, potentially affecting their long-term reliability and performance. Thus, accurate effective temperature measurement management are crucial to ensuring chip performance lifespan. This paper presents a multi-channel system based on diode temperature-sensitive array thermal test (TTC). The accurately emulates the heat power distribution of target chip, providing signal output through...
The development of semiconductor processes and advanced packaging technology has promoted significant advancements in the miniaturization integration electronic devices systems. However, these developments present substantial challenges to thermal stress design current chips, necessitating novel approaches address issues. Traditional finite element simulation-assisted methods have proven inadequate meeting demands highly integrated microsystems due their inability effectively simulate...
Self-heating inhibits the electrical characteristics improvement of GaN devices. The local hotspots generated in gate region significantly affect output performance This study proposes a near-junction cooling technique for thermal regulation GaN-on-SiC monolithic microwave integrated circuit power amplifier (MMIC PA). An embedded microchannel structure is into high-electron-mobility transistor (HEMT) substrate. dc characteristic curve actual HEMT reveals that designed induces 22.32% increase...
Sensitivity improvement and measurable pressure limit extension of Pirani vacuum gauge are urgent needed for meeting the rapid growing requirements in ultra-low wide-range applications. However, adjustable range measureable is limited to only several orders magnitude range. In this work, a fusion method was proposed improve sensitivity extend wafer-level packaged wider An analytical temperature model presented estimating electrothermal behavior suspended micro-heater with multi heat...
This study introduces an enhanced thermal management strategy for efficient heat dissipation from GaN power amplifiers with high densities. The advantages of applying advanced liquid-looped silicon-based micro-pin fin sink (MPFHS) as the mounting plate devices are illustrated using both experimental and 3D finite element model simulation methods, then compared against traditional materials. An IR thermography system was equipped to obtain temperature distribution mounted on three different...
The aim of this study was to investigate the cost-effectiveness serplulimab versus regorafenib in previously treated unresectable or metastatic microsatellite instability-high (MSI-H)/deficient mismatch repair (dMMR) colorectal cancer China.
This paper reports a dual-mode switching of highly sensitive thermal flow sensors based on calorimetric mode that is more suitable for microflow measurements. Upstream heating and downstream modes (which are both calorimetric) adopted in this paper. The sensor consists two vertically stacked suspended membrane MEMS chips. A gas micro channel fabricated inside the chip mounted perpendicular to direction. Due Laval effect, flowing through internal channels increases velocity improves heat...
Wireless communication, signal broadcasting, strictly limited resources in tags make RFID systems being confronted with many security attacks and privacy disclosure threats. In this paper，an efficient lightweight mutual authentication protocol is proposed, only requires O(1) work to identify authenticate a tag the backend server particularly suitable for low-cost because one-way hash function, XOR operation concatenation are needed tags. The performance of analyzed as well by comparing...
The recent art in relation extraction is distant supervision which generates training data by heuristically aligning a knowledge base with free texts and thus avoids human labelling. However, the concerned mentions often use bag-of-words representation, ignores inner correlations between features located different dimensions makes less effective. To capture complex characteristics of expression tighten correlated features, we attempt to discover utilise informative following four phases: 1)...
An improved physical model was proposed for accurate electrothermal modeling Pirani vacuum gauges (PVG) by accounting the micro-nano scale effects of heat transfer in sensitive elements and non-negligible corner dissipation from multiple sinks. This is verified published experimental data can reveal influences geometrical, process parameters, such as device dimensional size, temperature doping concentrations, on process, which a great consideration microelectromechanical systems (MEMS) PVG...