Binbin Jiao

ORCID: 0000-0003-0840-5785
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About
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Research Areas
  • Heat Transfer and Optimization
  • Heat Transfer and Boiling Studies
  • Advanced MEMS and NEMS Technologies
  • Infrared Target Detection Methodologies
  • Mechanical and Optical Resonators
  • Thermography and Photoacoustic Techniques
  • Advanced Semiconductor Detectors and Materials
  • Photonic and Optical Devices
  • CCD and CMOS Imaging Sensors
  • Heat Transfer Mechanisms
  • Thermal properties of materials
  • Advanced Sensor and Control Systems
  • Silicon Carbide Semiconductor Technologies
  • Advanced Algorithms and Applications
  • Thermal Radiation and Cooling Technologies
  • Calibration and Measurement Techniques
  • Advanced Sensor Technologies Research
  • Gas Sensing Nanomaterials and Sensors
  • Machine Fault Diagnosis Techniques
  • Photoacoustic and Ultrasonic Imaging
  • Advanced Sensor and Energy Harvesting Materials
  • Transition Metal Oxide Nanomaterials
  • Force Microscopy Techniques and Applications
  • Fluid Dynamics and Heat Transfer
  • Optical Systems and Laser Technology

Chinese Academy of Sciences
2015-2025

Institute of Microelectronics
2016-2025

Xi'an Jiaotong University
2021-2025

Tsinghua University
2025

Ministry of Agriculture and Rural Affairs
2025

Chinese Academy of Tropical Agricultural Sciences
2025

Shanghai Dianji University
2012-2025

Research Institute of Precision Instruments (Russia)
2025

Aerospace Information Research Institute
2024-2025

Shanghai Power Equipment Research Institute
2023

In recent decades, gallium nitride (GaN) high-electron-mobility transistor (HEMT) has become increasingly popular for microwave applications due to its wide bandgap and high saturated electron velocity. However, self-heating inhibits the improvement of electrical characteristics reduces device reliability. this study, a thermoelectric analysis based on embedded microfluidic cooling is performed. By embedding microchannel into silicon carbide (SiC) substrate, coolant can be introduced...

10.1109/ted.2022.3195482 article EN IEEE Transactions on Electron Devices 2022-08-25

10.1016/j.icheatmasstransfer.2025.108576 article EN International Communications in Heat and Mass Transfer 2025-01-05

When chips perform numerous computational tasks or process complex instructions, they generate substantial heat, potentially affecting their long-term reliability and performance. Thus, accurate effective temperature measurement management are crucial to ensuring chip performance lifespan. This paper presents a multi-channel system based on diode temperature-sensitive array thermal test (TTC). The accurately emulates the heat power distribution of target chip, providing signal output through...

10.3390/thermo5010006 article EN cc-by Thermo 2025-02-12

A parameter optimization-based variational modal decomposition-convolutional neural network-bidirectional long and short-term memory (VMD-CNN-BiLSTM) fault diagnosis model is proposed for the problem of three-phase motor bearing multi-level classification identification. Firstly, penalty factor components mode decomposition (VMD) are optimized using mixed-strategy crayfish optimization algorithm (MSCOA); then, time spectrum features signals extracted Convolutional Neural Network (CNN) fused;...

10.1117/12.3060053 article EN 2025-03-07

Thrips are key vectors for plant viruses, representing a significant challenge to the cultivation of cucurbits and other vegetables in tropical agriculture. This study investigates diversity viromes carried by thrips their ecological roles viral epidemics affecting specific crops. We identify populations regions perform comprehensive virome analysis through high-throughput sequencing. Our findings reveal that predominant species associated with these crops Frankliniella intonsa, palmi,...

10.3389/fmicb.2025.1540883 article EN cc-by Frontiers in Microbiology 2025-04-28

The development of semiconductor processes and advanced packaging technology has promoted significant advancements in the miniaturization integration electronic devices systems. However, these developments present substantial challenges to thermal stress design current chips, necessitating novel approaches address issues. Traditional finite element simulation-assisted methods have proven inadequate meeting demands highly integrated microsystems due their inability effectively simulate...

10.3390/mi16060669 article EN cc-by Micromachines 2025-05-31

Ion implantation is widely utilized in microelectromechanical systems (MEMS), applied for embedded lead, resistors, conductivity modifications and so forth. In order to achieve an expected device, the principle of ion must be carefully examined. The elementary theory including mechanism, projectile range implantation-caused damage target were studied, which can regarded as guidance MEMS device design fabrication. Critical factors implantations dose, energy annealing conditions are examined...

10.1142/s0217979218501709 article EN International Journal of Modern Physics B 2018-03-26

Herein, a microfabricated millimeter-level vapor alkali cell with high hermeticity is fabricated through wet etching and single-chip anodic bonding process. The cell, containing Rb N2, was investigated in coherent population trapping (CPT) setup for the application of chip-scale atomic clock (CSAC). contrast CPT resonance up to 1.1% within only 1 mm length light interacting atom. effects some critical external parameters on resonance, such as laser intensity, temperature, buffer gas...

10.3390/app12010436 article EN cc-by Applied Sciences 2022-01-03

This article presents a novel cross-rib micro-channel (MC-CR) heat sink to make fluid self-rotate. For thermal test chip (TTC) with 100 w/cm2, the cross-ribs were compared rectangular (MC-R) and horizontal rib (MC-HR) sinks. The results show that, micro-channel, junction temperature of was 336.49 K, pressure drop 22 kPa. Compared ribs sink, had improvements 28.6% 14.3% in cooling capability, but increased by 10.7-fold 5.5-fold, respectively. Then, effects aspect ratio (λ) different flow...

10.3390/mi13010132 article EN cc-by Micromachines 2022-01-14

Self-heating inhibits the electrical characteristics improvement of GaN devices. The local hotspots generated in gate region significantly affect output performance This study proposes a near-junction cooling technique for thermal regulation GaN-on-SiC monolithic microwave integrated circuit power amplifier (MMIC PA). An embedded microchannel structure is into high-electron-mobility transistor (HEMT) substrate. dc characteristic curve actual HEMT reveals that designed induces 22.32% increase...

10.1109/ted.2023.3338586 article EN IEEE Transactions on Electron Devices 2023-12-18

Sensitivity improvement and measurable pressure limit extension of Pirani vacuum gauge are urgent needed for meeting the rapid growing requirements in ultra-low wide-range applications. However, adjustable range measureable is limited to only several orders magnitude range. In this work, a fusion method was proposed improve sensitivity extend wafer-level packaged wider An analytical temperature model presented estimating electrothermal behavior suspended micro-heater with multi heat...

10.1109/jmems.2019.2954155 article EN Journal of Microelectromechanical Systems 2019-12-17

This study introduces an enhanced thermal management strategy for efficient heat dissipation from GaN power amplifiers with high densities. The advantages of applying advanced liquid-looped silicon-based micro-pin fin sink (MPFHS) as the mounting plate devices are illustrated using both experimental and 3D finite element model simulation methods, then compared against traditional materials. An IR thermography system was equipped to obtain temperature distribution mounted on three different...

10.3390/electronics9111778 article EN Electronics 2020-10-27
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