Jiang Lu

ORCID: 0000-0002-2573-3660
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About
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Research Areas
  • Silicon Carbide Semiconductor Technologies
  • Semiconductor materials and devices
  • Advancements in Semiconductor Devices and Circuit Design
  • HVDC Systems and Fault Protection
  • Electromagnetic Compatibility and Noise Suppression
  • Radiation Effects in Electronics
  • High-Voltage Power Transmission Systems
  • Aluminum Alloys Composites Properties
  • Thin-Film Transistor Technologies
  • Smart Grid and Power Systems
  • Power Systems and Renewable Energy
  • Electrostatic Discharge in Electronics
  • Advancements in Battery Materials
  • Semiconductor materials and interfaces
  • Freezing and Crystallization Processes
  • Microbial Inactivation Methods
  • Pulsed Power Technology Applications
  • Mental Health Research Topics
  • Power Line Communications and Noise
  • Magnetic Field Sensors Techniques
  • Antenna Design and Optimization
  • Ga2O3 and related materials
  • Simulation and Modeling Applications
  • Composite Structure Analysis and Optimization
  • Cellular and Composite Structures

Nanjing Normal University
2020-2025

Nanjing Normal University Taizhou College
2025

Northeastern University
2020-2024

Institute of Microelectronics
2008-2023

Chinese Academy of Sciences
2008-2023

Beijing Jiaotong University
2023

University of Chinese Academy of Sciences
2020

State Grid Hunan Electric Power Company Limited
2019

National University of Singapore
2012

China Electric Equipment Group (China)
2011

With low energy electron irradiation in the 80–250keV range, we were able to create only those intrinsic defects related initial displacements of carbon atoms silicon carbide lattice. Radiation induced majority and minority carrier traps analyzed using capacitance transient techniques. Four (EH1, Z1∕Z2, EH3, EH7) one hole trap (HS2) detected measured temperature range. Their concentrations show linear increase with dose, indicating that no divacancies or di-interstitials are generated. None...

10.1063/1.1778819 article EN Journal of Applied Physics 2004-10-28

Gallium nitride (GaN)-based vertical power Schottky barrier diode (SBD) has demonstrated outstanding features in high-frequency and high-power applications. This paper reviews recent progress on GaN-based SBDs, including the following sections. First, benchmark for GaN SBDs with different substrates (Si, sapphire, GaN) are presented. Then, latest edge terminal techniques discussed. Finally, a typical fabrication flow of is also illustrated briefly.

10.3390/electronics8050575 article EN Electronics 2019-05-24

In this article, the single-event response of 1.2-kV silicon-carbide (SiC) power MOSFETs with varied buffer layer designs is investigated by 2-D numerical simulations. The structural parameters layers are compared and analyzed to understand transient after heavy ion strike related physical mechanisms comprehensively. Simulation results reveal that an optimized single structure can be acquired using a relatively thicker (T μm) moderate doping concentration (D cm <sup...

10.1109/ted.2020.3008398 article EN IEEE Transactions on Electron Devices 2020-07-27

Abstract Heterostructures endow electrochemical hybrids with promising energy storage properties owing to synergistic effects and interfacial interaction. However, developing a facile but effective approach maximize interface is crucial challenging. Herein, bimetallic selenide heterostructure realized in confined carbon network via an situ strategy induce highly active stable electrode architecture. The dynamically formed heterostructures upon repeated delithiation/lithiation process not...

10.1002/aenm.202400498 article EN Advanced Energy Materials 2024-04-12

Based on audience preferences for short videos with rapid pace and plot twists, micro-series characterized by their brief, exhilarating, refined content have shown explosive growth. At the same time, they also led to considerable viewer addiction. This paper aims explore psychological mechanisms behind this addiction micro-series. Using case study analysis, it examines three representative works in China's industry: "Hi, Mom," "Auntie'sWorld," "Twenty-Nine." It analyzes why these series...

10.54254/2753-7048/2025.21103 article EN cc-by Lecture Notes in Education Psychology and Public Media 2025-02-21

In this article, theoretical modeling and vibration characteristics of a spinning double-blade beam assembly restricted by elastic supports are studied. Graphene nanoplatelet (GPL) reinforcement porous foamed metal matrix adopted to make up the structure. Due nonuniformity porosity graphene nanofillers, material properties attached blades considered change along blade thickness radius, respectively. They obtained via rule mixture, open-cell scheme Halpin-Tsai micromechanics model. These...

10.1080/15376494.2022.2035862 article EN Mechanics of Advanced Materials and Structures 2022-02-18

SiC MOSFET integrated with Schottky barrier diode (SBD) can handle the reverse current during switching operation and reduce package cost. However, SBD weakens high-voltage-withstanding capability of MOSFET. In this article, a novel 4H-SiC trench mesa-sidewall (TMS-SBD) is proposed studied 2-D simulation. Compared locating on mesa (TM-SBD), TMS-SBD shows larger breakdown voltage (BV), lower electric field in gate oxide, better tradeoff between BV specific ON-resistance. The also same as that...

10.1109/ted.2020.3037882 article EN IEEE Transactions on Electron Devices 2020-12-07

The <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${I}$ </tex-math></inline-formula> – notation="LaTeX">${V}$ characteristics of 4H-SiC N/P-channel MOSFETs have been carried out at high temperatures up to 300 °C. Different scattering mechanisms surface mobility for N-channel studied in this article. Moreover, the temperature dependencies various mobilities P-channel are given first time. Their were...

10.1109/ted.2021.3084908 article EN IEEE Transactions on Electron Devices 2021-06-14

Leakage current of 1200-V 4H-SiC Schottky barrier diodes (SBDs) with different structures increased by various degrees after heavy-ion exposure. By taking <inline-formula> <tex-math notation="LaTeX">${I}$ </tex-math></inline-formula>&#x2013;<inline-formula> notation="LaTeX">${V}$ </tex-math></inline-formula> measurements in a range 298 to 448 K, the voltage dependence saturation (<inline-formula> notation="LaTeX">$I_{0}$ </tex-math></inline-formula>), height notation="LaTeX">$\phi _{B0}$ and...

10.1109/tns.2022.3160181 article EN IEEE Transactions on Nuclear Science 2022-03-16

The threshold voltage ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> ) instability induced by gate stress has always been a significant reliability issue for silicon carbide (SiC) MOSFET. negative bias temperature (NBTI) of 4H-SiC p-channel MOSFET (pMOS) was studied experimentally at 200 °C and compared with that n-channel (nMOS). It is shown the drift pMOS...

10.1109/ted.2022.3166126 article EN IEEE Transactions on Electron Devices 2022-04-22

A novel 1200 V 4H-SiC MOSFET, which features a current spreading layer, split-gate and central P+ implant in the junction field effect transistor region (CSI-MOSFET), is proposed. The CSI-MOSFET achieves better trade-off among specific on-resistance, maximum electric gate oxide switching loss. comprehensively optimized with numerical simulation, then two kinds of CSI-MOSFETs (FCSI-MOSFET GCSI-MOSFET floating/grounded implant) are further investigated. Compared conventional double implanted...

10.1088/1361-6641/ab8fbf article EN Semiconductor Science and Technology 2020-05-04

The ability of high-voltage power MOSFETs to withstand avalanche events under different temperature conditions are studied by experiment and two-dimensional device simulation. is performed investigate dynamic failure behavior the domestic which can occur at rated maximum operation range (−55 150 °C). An advanced ISE TCAD mixed mode simulator with thermodynamic non-isothermal model used analyze mechanism. unclamped inductive switching measurement simulation results show that parasitic...

10.1088/1674-4926/32/1/014001 article EN Journal of Semiconductors 2011-01-01

CdSxSe1−x nanobelts with uniform and controllable composition are successfully fabricated by a one-step vapor-liquid-solid process. Temperature-dependent steady time-resolved transient photoluminescence (PL) studied for the obtained as well pure CdS CdSe prepared in same method. For all samples, both band edge surface state emission found to contribute observed PL spectra. However, originated from is quite weak compared CdSe. The reduced ascribed exciton localization due random potential...

10.1063/1.3702889 article EN Journal of Applied Physics 2012-04-01

In this paper, a new 200V power MOSFET structure with widened split gate trench to enhance single-event radiation hardness is proposed and studied by numerical simulation. The not only offers great Rds(on)×Q <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gd</sub> FOM, but also 55.3% wider radiation-hard Safe Operating Area (RHSOA) than the conventional structure. RHSOA advantage of device due elimination P-well region beneath N+ source almost...

10.1109/radecs.2016.8093147 article EN 2016-09-01

The ±500kV Xiluodu-Guangdong HVDC system in China is a 6400MW transmission double bipole scheme. It the new project designed scheme of two bipoles with common earth electrode and four DC lines erected on single tower. In contrast to traditional project, this obviously has further requirement for control protection system. First, detail research operating modes presented paper which fulfills both flexibility reliability requirements Then, well-designed hierarchical configuration put forward,...

10.1109/drpt.2011.5993868 article EN 2011-07-01

The ability of high-voltage power MOSFETs and IGBTs to withstand avalanche events under unclamped inductive switching (UIS) conditions is measured. This measurement investigate compare the dynamic failure behavior IGBT, which occur at different current conditions. UIS results show that main reason related parasitic bipolar transistor, leads deterioration reliability MOSFETs. However, IGBT two behaviors. At high mode, similar situation. But low mechanism thyristor activity during occurrence...

10.1088/1674-4926/34/3/034002 article EN Journal of Semiconductors 2013-03-01

The heavy ion radiation response and degradation of SiC junction barrier Schottky (JBS) diodes with different P+ implantation intervals (S) are studied in detail. experimental results show that the larger S, faster reverse leakage current increases, more serious after experiment. TCAD simulation shows electric field sensitive points directly affects rate devices structures. large transient energy introduced by impact can induce a local temperature increase device resulting lattice damage...

10.3390/electronics12092133 article EN Electronics 2023-05-06

Morphology-controlled Te nanostructures are synthesized by a viable and eco-friendly solution process, realizing the formation of high-quality two-dimensional tellurene one-dimensional nanotubes, nanowires, nanocables.

10.1039/d3ma00579h article EN cc-by-nc Materials Advances 2023-01-01

In this Letter, a 1.2 kV SiC power MOSFET with partially widened retrograde P‐well (RP) structure and N ‐implanting region is proposed to enhance the device's reliability. Compared conventional MOSFET, short circuit (SC) ability of can be improved effectively without sacrificing other performance. Simulation results reveal that 40% reduction SC saturation current achieved, resulting in withstand time increase from 7 10 μs at DC‐link voltage 800 V. Moreover, better gate oxide reliability...

10.1049/el.2020.1627 article EN Electronics Letters 2020-09-25

In this work, Sentaurus TCAD was used to study the transient surge current mechanism of 4H-SiC merged pin and schottky (MPS) diode. For first time, a structure combining multicells with transition region analyze MPS The electrothermal simulation analysis characteristics diode is carried out. Internal carrier distribution lattice temperature in process device are mainly studied. results show that hole electron not uniform. current, enters bipolar conduction mode, then, cells active enter mode...

10.1109/ted.2021.3122403 article EN IEEE Transactions on Electron Devices 2021-11-05

We present a single-event burnout (SEB) hardened planar power MOSFET with partially widened trench sources by three-dimensional (3D) numerical simulation. The advantage of the proposed structure is that work parasitic bipolar transistor inherited in suppressed effectively due to elimination most sensitive region (P-well below N+ source). simulation result shows can enhance SEB survivability significantly. critical value linear energy transfer (LET), which indicates maximum deposited on...

10.1088/1674-4926/39/3/034003 article EN Journal of Semiconductors 2018-03-01

This paper is a study on the transient overvoltage across converter valve in hybrid ultra high voltage direct current(UHVDC) transmission system which rectifier adopts Line commutated Converter(LCC), and inverter Source Converter(VSC). The arrester configuration for UHVDC proposed, electromagnetic model of built. Based model, stress are obtained conditions three-phase grounded fault at ac system, single-phase side upper bridge transformer dc line fault. It shows that arresters very large it...

10.1109/powercon.2018.8602108 article EN 2021 International Conference on Power System Technology (POWERCON) 2018-11-01
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