A5028986731- Photonic and Optical Devices
- Optical Network Technologies
- Semiconductor Lasers and Optical Devices
- Advanced Photonic Communication Systems
- Mechanical and Optical Resonators
- Photonic Crystals and Applications
- Optical Coatings and Gratings
- Advanced Fiber Laser Technologies
- Advanced MEMS and NEMS Technologies
- Advanced Fiber Optic Sensors
- Advanced Neuroimaging Techniques and Applications
- MRI in cancer diagnosis
- Acoustic Wave Resonator Technologies
- Advanced MRI Techniques and Applications
- Semiconductor Quantum Structures and Devices
- Functional Brain Connectivity Studies
- Advanced Neural Network Applications
- 3D IC and TSV technologies
- Advanced Measurement and Metrology Techniques
- Advanced Optical Sensing Technologies
- Radiomics and Machine Learning in Medical Imaging
- EEG and Brain-Computer Interfaces
- Neural Networks and Reservoir Computing
- Blind Source Separation Techniques
- Integrated Circuits and Semiconductor Failure Analysis
Shandong University of Traditional Chinese Medicine
2022-2025
Hangzhou Medical College
2019-2025
China Academy of Engineering Physics
2023-2025
Zhejiang Provincial People's Hospital
2021-2025
Guilin University of Electronic Technology
2018-2024
Shandong University of Finance and Economics
2019-2024
Philips (China)
2024
China Computer Federation
2024
University of Science and Technology Liaoning
2024
Beijing Aerospace Flight Control Center
2018-2023
Heterogeneous III-V-on-silicon photonic integration has proved to be an attractive and volume manufacturable solution that marries the merits of III-V compounds silicon technology for various integrated circuit (PIC) applications. The current main-stream Ethernet trends larger bandwidth are pushing higher modulation baudrate or employing advanced format datacom However, neither is likely able significantly drive overall cost energy efficiency best sweet spot, nor unfold full potential...
A low power Mach-Zehnder interferometer thermo-optic switch using free-standing silicon-on-insulator strip waveguides is demonstrated. The air gap provides thermal isolation between the waveguide arms and underlying silicon substrate. highly confined optical modes of enable miniature heated cross-sections. heating efficiency from on-chip resistive heaters enhanced. Measurements fabricated devices 100 microm arm lengths at 1550 nm wavelength result in a switching 540 microW, 10% - 90% rise...
Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm platform designed 25Gb/s and above applications at the three typical communication wavelengths compatible with 3D integration. Main process features device results are described.
We demonstrate coupling from tapered optical fibers to 450 nm by 250 silicon strip waveguides using compact cantilever couplers. The couplers consist of inverse width tapers embedded within dioxide cantilevers. Finite difference time domain simulations are used design the length taper as short 6.5 μm for a 2 μm. Modeling various waveguide profiles shows reduced losses quadratic profile. Infrared measurements fabricated devices average 0.62 dB per connection quasi-TE mode and 0.50 quasi-TM...
A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results packaging are discussed.
We demonstrate the first compact silicon photonics (SiPh) transceiver packaged in a QSFP form factor operating error free over 10 km of single mode fiber and 100m multimode using 25.6 GBaud PAM-4 optical signaling.
Micro-Hemispherical Resonator Gyroscopes (MHRGs) serve as essential components in inertial navigation systems. This research introduces a novel digital closed-loop control system for the application of force-to-rebalance mode. The proposed methodology utilizes self-excitation technique to initiate oscillation. First, amplitude oscillatory signal detected by Analog-to-Digital Converter (ADC) is calculated. subsequently amplified predetermined factor and multiplied with ADC-detected signal....
An intra-chip coupling scheme from optical fibers to silicon strip waveguides is demonstrated. The couplers consist of inverse width tapers embedded within dioxide cantilevers that are deflected out-of-plane by residual stress. Deflection angles 5 30 degrees obtained and controlled thermal annealing. Butt-coupling tapered or collimation-coupling lensed may be employed. enables direct access devices on the entire chip surface without dicing cleaving chip. Coupling efficiencies 1.6 dB per...
We address the effects of packaging on performance, reliability and cost photonic devices. For silicon photonics we some specific aspects. Finally propose an approach for integration ASICs.
We demonstrate low-power thermo-optic-based optical bistability in a free-standing silicon ring resonator. A bistable response is achieved at reduced pump powers by thermally isolating the resonator from its supporting substrate with an air gap. The conversion efficiency power to temperature change core enhanced. transfer function of resulting exhibits hysteresis loop for 80 microW input power. Similar nonthermally isolated resonators same detuning do not exhibit mode less than 2 mW.
We review a technology platform that enables monolithic integration of optical and electronic circuits in mainstream CMOS process demonstrate grating coupler with 0.75 dB insertion loss.
Current electronic interconnections in high performance computing (HPC) systems are reaching their limit supporting data traffic demands. Dense wavelength-division multiplexed (DWDM) links have gained interest as they can potentially alleviate these interconnect bandwidth demands while also lowering the cost and energy consumption compared to traditional links. In this article we present an analysis of a ring-based DWDM silicon photonic (SiP) link architecture with comb laser source p-i-n...
This paper covers a silicon photonics technology platform that leverages commercial semiconductor supply chain for the manufacturing of high performance optical transceivers computing and hyper-scale data-center applications.
We present an end-to-end multi-core fibre transmission link where the 8-core and corresponding 200 Gb/s silicon photonics transceiver chip were co-designed. demonstrate equivalent performance between MCF a parallel SMF links.
We discuss our strategy to build a dense wavelength division multiplexing optical transceiver enable high energy efficiency, scalable bandwidth, low latency data communication, and low-cost photonic integration simultaneously for high-performance computing applications.
The electrical interconnects in high performance computing (HPC) systems are reaching their bandwidth capacities supporting data-intensive applications. Currently, communication between compute nodes through these is the main bottleneck for overall HPC system performance. Optical based on emerging silicon photonics (SiP) platform considered to be a promising replacement boost speed of data transfer with reduced cost and energy consumption compared interconnects. In this paper, we present...
Perfectly vertical grating couplers have various applications in optical I/O such as connector design, coupling to multicore fibers and multilayer silicon photonics. However, it is challenging achieve perfectly without simultaneously increasing reflection. In this paper, we use the adjoint method well an adjoint-inspired methodology design devices that can be fabricated using only a single-etch step c-Si 193 nm DUV immersion lithography process, while maintaining good low Wafer-level testing...