Jongsoo Lee

ORCID: 0000-0001-8600-2602
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About
Contact & Profiles
Research Areas
  • Radio Frequency Integrated Circuit Design
  • Advancements in PLL and VCO Technologies
  • Energy Harvesting in Wireless Networks
  • Advanced MIMO Systems Optimization
  • Advanced Power Amplifier Design
  • Silicon Carbide Semiconductor Technologies
  • Advanced Wireless Communication Techniques
  • Electrostatic Discharge in Electronics
  • GaN-based semiconductor devices and materials
  • Wireless Networks and Protocols
  • Wireless Power Transfer Systems

Samsung (South Korea)
2020-2024

Gwangju Institute of Science and Technology
2012

Georgia Institute of Technology
2005

This article presents a fully integrated stand-alone narrowband Internet-of-Things (NB-IoT) and global navigation satellite system (GNSS) system-on-chip (SoC). It aims for an all-in-one to integrate all necessary blocks such as RF transceiver, power management (PMIP), clock save bills-of-material (BOM) cost. An transceiver is support multi-band cellular IoT GNSS with CMOS amplifier transmitting 23-dBm output power. A PMIP, including bucks, boost, low-dropout regulators (LDOs), coin cell or...

10.1109/jssc.2020.3012742 article EN IEEE Journal of Solid-State Circuits 2020-08-18

The Wi-Fi 7 standard (IEEE 802.11be) was developed to meet the growing need for increased capacity and high throughput. However, new, more demanding requirements RF/analog circuits, including an extended bandwidth of 320MHz with 4K-QAM, result in complexity circuit design address issues linearity, noise, bandwidth, power consumption. Despite these challenges, promises faster reliable wireless connectivity. This paper presents a transceiver that demonstrates excellent linearity smallest...

10.1109/isscc49657.2024.10454333 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2024-02-18

A monolithic active isolator combining common-base and common-collector configurations of SiGe heterojunction bipolar transistors (HBT) is used to improve reverse isolation in wireless system applications. This simple results an insertion loss 2 dB input IP3 +0.7 dBm over 5-6 GHz with a 1.8-mA current flow for the core circuit 3-V supply.

10.1109/lmwc.2005.845696 article EN IEEE Microwave and Wireless Components Letters 2005-04-01

This paper presents a single chip multiband power amplifier (MBPA) using proposed active load modulation (ALM) technique. Based on Doherty PA's concept, the MBPA consists of main amplifier, an auxiliary and transmission lines connecting two amplifiers to modulate amplifier's line over frequency. The ALM technique achieves desired at specific frequency band by three parameters; RF current ratio (α), characteristic impedance (Z <inf xmlns:mml="http://www.w3.org/1998/Math/MathML"...

10.1109/mwsym.2012.6258277 article EN IEEE MTT-S International Microwave Symposium digest 2012-06-01

As mobile applications have become more prevalent, the demand for higher network capacity and data rates has increased. This led to development of complicated platforms including RF transceivers that can support various frequency bands, a massive multiple-input multiple-output (MIMO), multiple carrier components (CCs) aggregations (CAs). paper presents fully integrated, versatile transceiver designed handle high achieve cost-efficient solution, incorporating techniques. The comprises 24...

10.1109/isscc49657.2024.10454281 article EN 2022 IEEE International Solid- State Circuits Conference (ISSCC) 2024-02-18

Integrated spiral inductors are investigated to obtain an optimal design for low cost IC processes. For this study, different inductor structures were fabricated determine the best topology suited optimizing Q factor. The studied include patterned ground shield, hollow and stacked inductors. A new using two metal layers is developed reduce resistive loss of integrated planar have 4.5 turns 8 turns, respectively. shield found enhance factor from 1.9 up 3.8 in inductors, 1.6 2.5 show slightly...

10.1109/secon.2005.1423229 article EN 2005-04-25
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