J. Gunnell
A5080851198- Particle Detector Development and Performance
- Radiation Detection and Scintillator Technologies
- Particle physics theoretical and experimental studies
- Medical Imaging Techniques and Applications
- Magnetic Field Sensors Techniques
- CCD and CMOS Imaging Sensors
- Non-Destructive Testing Techniques
- Advancements in Semiconductor Devices and Circuit Design
- Advanced Electrical Measurement Techniques
- 3D IC and TSV technologies
- Advanced Optical Imaging Technologies
- Offshore Engineering and Technologies
- Corrosion Behavior and Inhibition
- Digital Holography and Microscopy
- Image Processing Techniques and Applications
- Atomic and Subatomic Physics Research
- Experimental Learning in Engineering
- Industrial Vision Systems and Defect Detection
University of California, Santa Cruz
2020-2024
Abstract The ATLAS experiment is constructing new all-silicon inner tracking system for HL-LHC. strip detectors cover the radial extent of 40 to 100 cm. A approach adopted use p-type silicon material, making readout in n + -strips, so-called -in-p sensors. This allows enhanced radiation tolerance against an order magnitude higher particle fluence compared LHC. To cope with varying hit rates and occupancies as a function distance, there are two barrel sensor types, short strips (SS) 2 long...
For the Phase-II Upgrade of ATLAS Detector [1], its Inner Detector, consisting silicon pixel, strip and transition radiation sub-detectors, will be replaced with an all new 100% tracker, composed a pixel tracker at inner radii outer radii. The future include 11,000 sensor modules in central region (barrel) 7,000 forward (end-caps), which are foreseen to constructed over period 3.5 years. construction each module consists series assembly quality control steps, were engineered identical for...
Abstract The high-luminosity upgrade of the Large Hadron Collider, scheduled to become operational in 2029, requires replacement ATLAS Inner Detector with a new all-silicon Tracker. Radiation hard n + -in-p micro-strip silicon sensors were developed by Tracker strip collaboration and are produced Hamamatsu Photonics K.K. Production total amount 22000 has started 2020 will continue until 2025. sensor responsibility monitor quality fabricated devices performing detailed measurements individual...
The Quality Control (QC) of pre-production strip sensors for the Inner Tracker (ITk) ATLAS Detector upgrade has finished, and collaboration embarked on QC test programme production sensors. This will last more than 3 years comprises evaluation approximately 22000 8 Types sensors, 2 barrel 6 endcap, be measured at many different collaborating institutes. sustained throughput requirement combined processes is around 500 per month in total. Measurement protocols have been established acceptance...
Abstract For the Phase-II Upgrade of ATLAS Detector, Inner Detector will be replaced with Tracker (ITk), consisting a pixel and strip tracker. The 17,888 silicon detector modules comprising ITk tracker assembled from sensors flexes readout chips in manual assembly process performed at 20 module sites complex distribution chain, which requires quality control steps to after each step. Sensor visual inspection full sensor area (about 100 cm 2 ) detect log any defects (e.g. scratches, breakdown...
Abstract A mobile Compton backscatter imaging device 60 using a 10 Ci CO60 source is proposed for corrosion monitoring of underwater offshore oil risers, in the presence marine growth or protective coatings. The design prototype detector system presented and its performance evaluated terms interdependence scanning speed, defect volume detection probability, false alarm probability. An apparatus constructed to confirm some aspects weak gamma ray described first results on observation 6mm...
Abstract In preparation for the High Luminosity LHC (HL-LHC) runs, ATLAS inner detector will be completely replaced with an all silicon Inner Tracker (ITk). Hybrid pixel modules used innermost tracking layers, and micro-strip detectors outer layers of tracker. During production detector, sensors, readout electronics, other components undergo a series quality control (QC) assurance tests. Defects in fabrication sensors flagged early manufacturer's QC A study influence sensor defects was...